Materials and processes issues in fine pitch eutectic solder flip chip interconnection

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04

Volumn , Issue , 2004, Pages 213-220

  Liu, C ^a   Hendriksen, M W ^b   Hutt, D A ^a   Conway, P P ^a   Whalley, D C ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^b Celestica   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RESISTANCE; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; FLIP CHIP DEVICES; NICKEL PLATING; PRODUCT DESIGN; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY;

BALL GRID ARRAYS (BGA); BONDPADS; FLIP CHIP ON BOARD (FCOB); UNDER BUMP METALLISATION (UBM);

CHIP SCALE PACKAGES;

EID: 14844292147     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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