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IEEE Transactions on Advanced Packaging

Volumn 23, Issue 1, 2000, Pages 3-8

Redistribution and bumping of a high I/O device for flip chip assembly

(3) Keser, Lizabeth A a Bajaj, Rajiv a Fang, Treliant a

a MOTOROLA INC (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BUTENES; DIELECTRIC MATERIALS; FLIP CHIP DEVICES; NICKEL METALLURGY; PERMITTIVITY; PHOTORESISTS; PHOTOSENSITIVITY; SHEAR STRENGTH; SOLDERING;

BENZOCYCLOBUTENE; SOLDER BUMPING;

ELECTRONICS PACKAGING;

EID: 0033893693 PISSN: 15213323 EISSN: None Source Type: Journal
DOI: 10.1109/6040.826754 Document Type: Article

Times cited : (13)

References (9)

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4
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- Mis, J.D.¹ Rinnae, G.A.² Deane, P.A.³ Adema, G.M.⁴

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