Interconnect solutions for advanced area array packaging

Microelectronics International

Volumn 16, Issue 2, 1999, Pages 49-54

  Hendriksen, M W ^a   Frimpong, F K ^a   Ekere, N N ^b  

^a Celestica Limited   (United Kingdom)

^b NONE

Author keywords

Electronics packaging; Interconnection; Laminates; Microvias; Printed circuit boards

Indexed keywords

EID: 0011016697     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565369910268277     Document Type: Article

References (6)

1. Brinton, J.B., "CSP is finally moving into volume production". Semiconductor Business News, August 1998, pp. 14-21.
2. Holden, H., "How to use high-density interconnect structures with fine-pitch area array components", ChipScale Review, Vol. 1 No. 3, September 1997, pp. 54-7.
3. The National Technology Roadmap for Electronic Interconnections, The Institute for Interconnecting and Packaging Electronic Circuits (IPC), 1997.
4. Miller, J.C. and Geohegan, D.B. (Eds), "Laser ablation: mechanisms and applications - II", AIP Conference Proceedings 288, AIP, New York, NY, 1993.
5. Forcier, R.A., "Multilayer materials for 2000", Printed Circuit Fabrication, Vol. 16 No. 2, February 1993.
6. Seah, M.P. et al., "Blowholing in PTH solder fillets, part 3: moisture and the PCB", Circuit World, Vol. 12 No. 4, 1986, pp. 26-33.