Bumping of silicon wafers by stencil printing

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1999, Pages 313-319

  Adriance, James H ^a   Whitmore, Mark A ^a   Schake, Jeffrey D ^a  

^a UNIVERSAL INSTRUMENTS CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL CLEANING; SEMICONDUCTOR DEVICE MANUFACTURE;

STENCIL PRINTING;

SILICON WAFERS;

EID: 0033322541     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)