Polymer film deposition with fine pitch openings by stencil printing

Microelectronics Reliability

Volumn 43, Issue 3, 2003, Pages 473-479

  Ezawa, Hirokazu ^a   Seto, Masaharu ^a   Miyata, Masahiro ^a   Tazawa, Hiroshi ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; LITHOGRAPHY; LSI CIRCUITS; PERMITTIVITY; POLYIMIDES; RHEOLOGY; VISCOSITY;

STENCIL PRINTING;

PLASTIC FILMS;

EID: 0037373335     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00327-X     Document Type: Conference Paper

References (5)

1. Li Li, Thompson P. Stencil printing process development for flip chip interconnect. IEEE Trans. Electron. Packag. Manuf. 23(3):2000;165-170.
2. Kloeser J., Coskina P., Aschenbrenner R., Reichl H. Bump formation for flip chip and CSP by solder paste printing. Microelectron. Reliab. 42:2002;391-398.
3. Nishizawa H., Suzuki K., Kikuchi T., Satou H. New screen printable polyimide for IC devices. IEEE Trans. Components, Hybrids, Manuf. Technol. 13(4):1990;775-779.
4. http://www.cgco.co.jp.
5. Patel CS, Realff M, Merriweather S, Power C, Martin K, Meindl JD. Cost analysis of compliant wafer level package, In: Proccedings of the 50th Electronic Components and Technology Conference, 2000. p. 1634-9.