Critical variables of solder paste stencil printing for micro-BGA and fine pitch QFP

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1999, Pages 94-101

  Pan, Jianbiao ^a   Tonkay, Gregory L ^a   Storer, Robert H ^a   Sallade, Ronald M ^a   Leandri, David J ^a  

^a LEHIGH UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE PASTES; SOLDERING; SURFACE MOUNT TECHNOLOGY;

BALL GRID ARRAYS (BGA); QUAD FLAT PACKAGE (QFP); SOLDER PASTES; STENCIL PRINTING;

ELECTRONICS PACKAGING;

EID: 0033330697     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)