Fine pitch stencil printing using enclosed printing systems

Soldering and Surface Mount Technology

Volumn 15, Issue 1, 2003, Pages 43-49

  Zou, Ling Chunxian ^a   Dusek, Milos ^a   Wickham, Martin ^a   Hunt, Christopher ^a  

^a NATIONAL PHYSICAL LABORATORY   (United Kingdom)

Author keywords

Assembly; Solder pastes; Stencils

Indexed keywords

ADHESIVE PASTES; DEGRADATION; PRINTING; PROCESS ENGINEERING; SUBSTRATES; SURFACES;

ENCLOSED PRINTING SYSTEMS; SOLDER PASTES; STENCIL;

SOLDERING;

EID: 0037214789     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910310455725     Document Type: Article

References (8)

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7. Rodriguez, G. and Baldwin, D. F. (1999), "Analysis of solder paste release in fine pitch stencil printing process", ASME Journal of Electronic Packaging, Vol. 121 No. 3, pp. 169-178.
8. Whitmore, M. (1998), "DirEKt imaging a new technique for dynamic printing control", Proceedings of the Technical Program, Nepcon West, 1-5 March 1998, CA, Vol. 1, pp. 134-45.