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Volumn 25, Issue 1, 2002, Pages 38-44
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Squeegee bump technology
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Author keywords
Bump; Flip chip; Interconnect; Screen print; Solder; Squeegee; Stencil print
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Indexed keywords
SOLDER BUMPING;
DEGRADATION;
ELECTROPLATING;
MASKS;
PHOTORESISTS;
SHEAR STRENGTH;
SOLDERING ALLOYS;
THERMAL CYCLING;
FLIP CHIP DEVICES;
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EID: 0036506146
PISSN: 15213331
EISSN: None
Source Type: Journal
DOI: 10.1109/6144.991173 Document Type: Article |
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Times cited : (5)
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References (7)
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