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Journal of Materials Science: Materials in Electronics

Volumn 14, Issue 8, 2003, Pages 501-506

Monte Carlo study of solder paste microstructure and ultra-fine-pitch stencil printing

(5) He, D A a Ekere, N N a Salam, B a Rajkumar, Durairaj a Jackson, a

a UNIVERSITY OF GREENWICH (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE PASTES; COMPUTER SIMULATION; MICROSTRUCTURE; MONTE CARLO METHODS; PARTICLE SIZE ANALYSIS; SOLDERING; STATISTICAL METHODS; SURFACE MOUNT TECHNOLOGY; VOLUME FRACTION;

SOLDER PASTE; ULTRA FINE PITCH STENCIL PRINTING;

SOLDERING ALLOYS;

EID: 0038445923 PISSN: 09574522 EISSN: None Source Type: Journal
DOI: 10.1023/A:1023929119055 Document Type: Article

Times cited : (13)

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