Faraday in the fab: A look at copper plating equipment for on-chip wiring

Electrochemical Society Interface

Volumn 13, Issue 4, 2004, Pages 40-44

  Beaudry, Christopher L ^a   Dukovic, John O ^a  

^a Appl Mat Electrochem Plating Div

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CONTAMINATION; DIELECTRIC DEVICES; ELECTRODEPOSITION; ELECTROPLATING; ETCHING; GRAIN SIZE AND SHAPE; MICROPROCESSOR CHIPS; NUCLEATION; PHYSICAL VAPOR DEPOSITION; SEMICONDUCTOR MATERIALS;

DAMASCENE PROCESSING; DIELECTRIC DEPOSITION; MICROELECTRONICS INDUSTRY; ON-CHIP WIRING;

COPPER PLATING;

EID: 12344309098     PISSN: 10648208     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

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