Laser Dicing of Chip Scale and Silicon Wafer Scale Packages

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2003, Pages 1-5

  Lizotte, Todd ^a  

^a LP ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; MICROPROCESSOR CHIPS; QUALITY CONTROL; SILICON WAFERS; BATCH DATA PROCESSING; DIAMOND CUTTING TOOLS; DIAMONDS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INDUSTRIAL ELECTRONICS; LASER APPLICATIONS; LASER BEAM CUTTING; LASER BEAMS; LASER MATERIALS PROCESSING; MANUFACTURE; MOUNTINGS; OPTICAL MATERIALS; PACKAGING MATERIALS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUITS; SAWING; SILICON;

WAFER SCALE PACKAGES;

CHIP SCALE PACKAGES;

BLADES; CHIP-SCALE PACKAGING; FLIP CHIP; OPTICAL DEVICE FABRICATION; PAPER TECHNOLOGY; SAWING MACHINES;

EID: 0141788780     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Peter-M. Heinze, "Thin Wafer Processing In Pre-Assembly", TAP Technology, pp. 45-47, October 1997
2. R. Fox, "Dicing Improvements: Yield Enhancement, Throughput Increase and Die Size Reduction in M/ACOM's GaAs Fab", Digest of Papers, GaAs Mantech Conference, May 21-24, Las Vegas, pp. 48-51, 2001.
3. H. K. Tönshoff, A. Ostendorf, T. Wagner, "Structuring Silicon with Femtosecond Lasers", handout.
4. M. Feil, C. Adler, G. Klink & M. König: "Interconnection Techniques for Ultra Thin ICs and MEMS Elements" Proceedings of Microsystems Technologies 2001, Mesago, Stuttgart, pp. 437-442, 2001.
5. J. Bonse, S. Baudach, J. Kruger and W. Kautek. "Femtosecond laser micromachining of technical materials", SPIE Proceedings vol 4065 pp. 161-272, 2000.
6. Lizotte, T., Ohar, O., O'Keefe, T. "Laser Drilling Speeds BGA Packaging," Solid State Technology, September 1996, p. 120-128.
7. Lizotte, Todd, "Cleaning Laser Debris from TAB Circuits," Advanced Packaging, January 2002, p. 38-40.
8. Y.G Yingling et al.," The role of photochemical fragmentation in laser ablation: a molecular dynamics study", Journal of Photochemistry and Photobiology A: Chemistry 145, pp 173-181, 2001