The effects of on-chip and package decoupling capacitors and an efficient ASIC decoupling methodology

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 556-567

  Na, Nanju ^a   Budell, Timothy ^a   Chiu, Charles ^a   Tremble, Eric ^a   Wemple, Ivan ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ON-CHIP POWER BUS STRUCTURE; RESONANT FREQUENCY; SWITCHING CIRCUITRY; TRANSIENT CURRENTS;

APPLICATION SPECIFIC INTEGRATED CIRCUITS; COMPUTER SIMULATION; COUPLED CIRCUITS; ELECTRIC POTENTIAL; ELECTRONICS PACKAGING; MICROPROCESSOR CHIPS; RESONANCE; SWITCHING CIRCUITS;

CAPACITORS;

EID: 10444243296     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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