Power distribution system for JEDEC DDR2 memory DIMM

Electrical Performance of Electronic Packaging

Volumn , Issue , 2003, Pages 121-124

  Smith, Larry D ^a   Lee, Jeffery ^a  

^a SUN MICROSYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC CAPACITORS; ELECTRONICS PACKAGING; FREQUENCY DOMAIN ANALYSIS; HARDWARE;

DDR2 MEMORY; FREQUENCY DOMAINS; MEMORY MODULES; POWER DISTRIBUTION SYSTEM; TARGET IMPEDANCES;

CAPACITORS;

EID: 10444274509     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2003.1250013     Document Type: Conference Paper

References (4)

1. L.D. Smith, R.E. Anderson, D.W. Forehand, T.J. Pelc, T. Roy, "Power Distribution System Design Methodology and Capacitor Selection for Modem CMOS Technology, " IEEE Transactions on Advanced Packaging, Vol.22, No.3, August 1999, P284.
2. L.D.Smith, D.Hockanson, K.Kothari, "A Transmission-Line Model for Ceramic Capacitors for CAD Tools Based on Measured Parameters" Proc 52nd Electronic Components & Technology Conference, San Diego, CA., May 2002. pp.331-336.
3. I. Novak, "Measuring Milliohms and PicoHeniys in Power Distribution Networks, " Design Con 2000.
4. L.D.Smith, T.Roy, R.E.Anderson, "Power Plane SPICE Models for Frequency and Time Domains, " IEEE Transactions on Advanced Packaging, August 2001, P277.