Accurate HSPICE modeling of arbitrary package geometries using transmission-line equivalent techniques

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 988-1003

  Budell, T ^a   Clouser, P ^a   Tremble, E ^a   Welch, B ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; COMPUTER HARDWARE; COMPUTER SIMULATION; ELECTRIC IMPEDANCE; ELECTRIC NETWORK TOPOLOGY; ELECTRIC POWER SUPPLIES TO APPARATUS; EQUIVALENT CIRCUITS; SPURIOUS SIGNAL NOISE; TRANSMISSION LINE THEORY;

CAVITY NOISE; EQUIVALENT CIRCUIT SIMULATION ENGINE; HIGH SPEED TRANSMISSION LINE EQUIVALENT CIRCUITS;

ELECTRONICS PACKAGING;

EID: 0038012471     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)

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