Compliant die-package interconnects at high frequencies

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1237-1243

  Braunisch, Henning ^a   Hwang, Kyu Pyung ^a   Emery, Richard D ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; DIELECTRIC MATERIALS; ELECTRIC CONDUCTIVITY; ELECTRIC RESISTANCE; INDUCTANCE; INSERTION LOSSES; INTERFACES (MATERIALS); PERMITTIVITY; SOUND INSULATION;

CAPACITANCE COMPENSATION; DIE-PACKAGE INTERCONNECTS; INDUCTIVE TRANSITION; RESISTIVE TRANSITION;

ELECTRONICS PACKAGING;

EID: 10444239308     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

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