Sea of leads microwave characterization and process integration with FEOL and BEOL

Proceedings of the IEEE 2002 International Interconnect Technology Conference, IITC 2002

Volumn , Issue , 2002, Pages 116-118

  Bakir, M S ^a   Thacker, H D ^a   Zhou, Zhiping ^a   Kohl, P A ^a   Martin, K P ^a   Meindl, J D ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INSERTION LOSSES; INTEGRATED CIRCUIT INTERCONNECTS; SILICON WAFERS; SUBSTRATES;

BACK END OF THE LINES; FRONT END OF THE LINES; GHZ FREQUENCIES; HIGH-DENSITY SUBSTRATES; MICROWAVE CHARACTERIZATION; MULTICRYSTALLINE SI; PROCESS INTEGRATION; SIGNAL PATHS;

SOLS;

EID: 10444277751     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2002.1014906     Document Type: Conference Paper

References (7)

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