Compliant Cantilevered Spring Interconnects for Flip-Chip Packaging

Advances in Electronic Packaging

Volumn 3, Issue , 2001, Pages 1909-1915

  Ma, Lunyu ^a   Zhu, Qi ^a   Modi, Mitul ^a   Sitaraman, Suresh K ^a   Chua, Chris ^b   Fork, David K ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b PALO ALTO RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CANTILEVER SPRING INTERCONNECTS; DAISY CHAINS;

DYNAMIC MECHANICAL ANALYSIS; ELECTRIC POWER SYSTEM INTERCONNECTION; ELECTRIC RESISTANCE; FLIP CHIP DEVICES; MAGNETRON SPUTTERING; PHOTOLITHOGRAPHY; QUARTZ; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SOLDERING; STRESS ANALYSIS; SUBSTRATES; THERMAL CYCLING; THERMAL EXPANSION;

CHIP SCALE PACKAGES;

EID: 0346307638     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. th Electronic Components and Technology Conference, 2000, pp. 1157-1163.
2. The National Technology Roadmap for Semiconductors: Technology Needs, Semiconductor Industry Association, 1997, P.40.
3. Hoffman, D.W. and Thornton J.A., "Internal stresses in Cr, Mo, Ta, and Pt films deposited by sputtering from a planar magnetron source," J. Vac. Sci. Tech., 20(3), pp. 355-358.
4. th Electronic Component and Technology Conference, 1999, pp. 111-117.