Compliant cantilevered spring interconnects for flip-chip packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 761-766

  Ma, Lunyu ^a   Zhu, Qi ^a   Sitaraman, Suresh K ^a   Chua, Chris ^b   Fork, David K ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b PALO ALTO RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; DYNAMIC MECHANICAL ANALYSIS; FLIP CHIP DEVICES; HEAT RESISTANCE; MATHEMATICAL MODELS; SEMICONDUCTOR DEVICE STRUCTURES; THERMAL CYCLING; THERMAL EXPANSION; THERMAL VARIABLES MEASUREMENT; THIN FILMS;

CANTILEVERED SPRING INTERCONNECTS; FLIP CHIP PACKAGING; SLIDING CONTACT;

ELECTRONICS PACKAGING;

EID: 0034822226     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2001.927863     Document Type: Article

References (4)

1. Flexible micro-spring interconnects for high performance probing
2. The national technology roadmap for semiconductors
3. Internal stresses in Cr, Mo, Ta, and Pt films deposited by sputtering from a planar magnetron source
4. Are we over designing for solder joint reliability? Field vs. accelerated conditions, realistic vs. specified requirements