Coupled thermal electric modeling of flexible nanospring interconnects for high-performance probing

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 721-729

  Ahmad, M ^a   Sitaraman, S K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC RESISTANCE; MICROELECTRONICS; NANOSTRUCTURED MATERIALS; PROBES; RELIABILITY; SCANNING ELECTRON MICROSCOPY; TEMPERATURE; THERMOELECTRICITY;

COUPLED THERMAL ELECTRIC MODELING; FLEXIBLE NANOSPRING INTERCONNECTS; ULTRA FINE PITCH CAPABILITY;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0034828965     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. Flexible mico spring interconnects for high performance probing
2. A new flip-chip technology for high density packaging
3. Flip-chip bonding on 6-μm pitch using thin-film microspring technology
4. Principles of conduction through electrical contacts
5. Thermal conductivity of thin metallic films
6. Thermal conductivity of optical coatings
7. Contact modeling of flexible nanospring interconnects for high performance probing
8. Novel nanospring interconnects for high-density applications