Novel nanospring interconnects for high-density applications

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2001, Pages 372-378

  Ma, L ^a   Zhu, Q ^a   Sitaraman, S K ^a   Chua, C ^a   Fork, D K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RESISTANCE; FABRICATION; RELIABILITY; SPRINGS (COMPONENTS); STRAIN RATE; STRESS ANALYSIS; THERMAL CYCLING; THERMAL EXPANSION;

NANOSPRING INTERCONNECTS;

CHIP SCALE PACKAGES;

EID: 0035008031     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)