Dry etching of NiFe/Co and NiFe/Al-O/Co multilayers in an inductively coupled plasma of Cl 2/Ar mixture

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 22, Issue 6, 2004, Pages 2388-2391

  Ra, H W ^a   Hahn, Y B ^a   Song, K S ^b   Park, M H ^c   Hong, Y K ^c  

^a Chonbuk National University   (South Korea)

^b Korea Institute of Energy Research (KIER)   (South Korea)

^c UNIVERSITY OF IDAHO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ETCH MECHANISM; ETCH PRODUCTS; ETCH RATE; SIDEWALL CONTAMINATION;

ANISOTROPY; ARGON; AUGER ELECTRON SPECTROSCOPY; CHLORINE; COBALT; CONTAMINATION; DESORPTION; INDUCTIVELY COUPLED PLASMA; MAGNETIC FILMS; MORPHOLOGY; MULTILAYERS; NICKEL COMPOUNDS; SCANNING ELECTRON MICROSCOPY; SURFACE PROPERTIES; THIN FILMS;

DRY ETCHING;

EID: 10244279216     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1806441     Document Type: Article

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