Dry etching mechanism of copper and magnetic materials with UV illumination

Materials Science and Engineering B: Solid-State Materials for Advanced Technology

Volumn 79, Issue 1, 2001, Pages 20-26

  Hahn, Y B ^a   Pearton, S J ^b   Cho, H ^c   Lee, K P ^b  

^a Chonbuk National University   (South Korea)

^b J Crayton Pruitt Family Department of Biomedical Engineering   (United States)

^c Miryang National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; BINDING ENERGY; DRY ETCHING; ELECTRIC DISCHARGES; INTERFACES (MATERIALS); LIGHT ABSORPTION; MAGNETIC MATERIALS; PHOTODISSOCIATION; ULTRAVIOLET RADIATION;

INDUCTIVELY COUPLED PLASMA (ICP) REACTORS; ULTRAVIOLET ILLUMINATION;

COPPER;

EID: 0035096909     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5107(00)00545-6     Document Type: Article

References (32)

1. Sesselmann W., Marinero E.E., Chuang J. Appl. Phys. A. 41:1986;209.
2. Sesselmann W., Chuang T.J. Surf. Sci. 176:1986;32-90.
3. Brannon J.H., Brannon K.W. J. Vac. Sci. Technol. B. 7:1989;1275.
4. Brannon J.H. IEEE Circuits Devices. 13:1997;11.
5. Choi K.-S., Han C.-H. J. Electrochem. Soc. 145:1998;L37.
6. Choi K.-S., Han C.-H. Jpn. J. Appl. Phys. 37:1998;5945.
7. Kwon M.S., Lee J.Y., Choi K.-S., Han C.-H. Jpn. J. Appl. Phys. 37:1998;4103.
8. M.S. Kwon J.Y. Lee, J. Electrochem. Soc., in press.
9. Ohsita Y., Hosoi N. Thin Solid Films. 262:1995;67.
10. Schwartz G.C., Schaible P.M. J. Electrochem. Soc. 130:1983;1777.
11. Ohno K., Sato M., Arita Y. Jpn. J. Appl. Phys. 28:1989;L1070.
12. Howard B.J., Steinbrüchel C. Appl. Phys. Lett. 59:1991;914.
13. Lee S.-K., Chun S.-S., Hwang C.Y., Lee W.-J. Jpn. J. Appl. Phys. 36:1997;50.
14. Russek S.E., Oti J.O., Kaka S., Chen E.Y. J. Appl. Phys. 85:1999;4773.
15. van Delft F.C.M.J. J. Magn. Mag. Mater. 140-144:1995;2203.
16. Fischl D.S., Hess D. J. Vac. Sci. Technol. B6:1988;1577.
17. Kinoshita K., Yamada K., Matutera H. IEEE Trans. Magn. 27:1991;4888.
18. Jung K.B., Lambers E.S., Childress J.R., Pearton S.J., Jenson M., Hurst A.T. Appl. Phys. Lett. 71:1997;1255.
19. Jung K.B., Hong J., Cho H., Caballeco J.A., Childress J.R., Pearton S.J., Jenson M., Hurst A.T. Appl. Surf. Sci. 138/139:1999;111.
20. Nakatani I. IEEE Trans. Magn. 32:1996;4448.
21. Jung K.B., Hong J., Cho H, Onishi S., Johnson D., Park Y.D., Childress J., Pearton S.J. J. Vac. Sci. Technol. A. 17:1999;535.
22. Jung K.B., Cho H., Hahn Y.B., Lambers E.S., Onishi S., Johnson D., Hurst A.T., Childress J.R., Park Y.D., Pearton S.J. J. Appl. Phys. 85:1999;4788.
23. CRC Handbook of Chemistry and Physics, 79th ed., CRC Press, Cleveland, OH, 1998/1999.
24. Kaifu Y., Komatsu T. Phys. Stat. Sol. B48:1971;K125.
25. Chase M.W. Jr. NIST-JANAF Thermochemical Tables. fourth ed. 1998;American Institute of Physics for the National Institute of Standards and Technology.
26. J.W. Coburn, Plasma Etching and RIE: Fundamentals and Applications, AVS Short Course Program, Florida Chapter, Orlando, FL, March, 1999.
27. NIST Chemistry Webbook, http://webbook.nist.gov/chemistry/ .
28. H. Cho, K.P. Lee, Y.B. Hahn, E.S. Lambers, S.J. Pearton, J. Vac. Sci. Technol. A 18 (4) July/August (2000).
29. Cho H., Lee K.P., Hahn Y.B., Lambers E.S., Pearton S.J. Mater. Sci. Eng. B. 67:1999;145.
30. Winters H.F. J. Vac. Sci. Technol. B. 3:1985;9.
31. Winters H.F. J. Vac. Sci. Technol. A. 3:1985;786.
32. Touloukian Y.S., Ho C.Y. Properties of Selected Ferrous Alloying Elements. III-1:1981;McGraw-Hill, New York, NY.