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Volumn , Issue , 2003, Pages 770-777

Statistical Verification of Power Grids Considering Process-Induced Leakage Current Variations

Author keywords

[No Author keywords available]

Indexed keywords

DELAY CIRCUITS; LOGIC GATES; MICROPROCESSOR CHIPS; MOSFET DEVICES; SPURIOUS SIGNAL NOISE; STATISTICAL METHODS; THRESHOLD VOLTAGE; TRANSISTORS;

EID: 0346148441     PISSN: 10923152     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/iccad.2003.159764     Document Type: Conference Paper
Times cited : (30)

References (20)
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    • (1995) IEEE Transactions on Communications , vol.43 , Issue.12 , pp. 2869-2873
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  • 2
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    • K. A. Bowman, S. G. Duvall, and J. D. Meindl. Impact of die-to-die and within-die parameter fluctuations on the maximum clock frequency distribution. In International Solid State Circuits Conference, pages 278-279, 2001.
    • (2001) International Solid State Circuits Conference , pp. 278-279
    • Bowman, K.A.1    Duvall, S.G.2    Meindl, J.D.3
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    • Implications of fundamental threshold voltage variations for high-density SRAM and logic circuits
    • D. Burnett, K. Eringtron, C. Subramanian, and K. Baker. Implications of fundamental threshold voltage variations for high-density SRAM and logic circuits. In Symposium on VLSI Technology, pages 15-16, 1994.
    • (1994) Symposium on VLSI Technology , pp. 15-16
    • Burnett, D.1    Eringtron, K.2    Subramanian, C.3    Baker, K.4
  • 5
    • 0033362679 scopus 로고    scopus 로고
    • Technology and design challenges for low power and high performance
    • San Diego, CA, August 16-17
    • V. De and S. Borkar. Technology and design challenges for low power and high performance. In ACM/IEEE International Symposium on Low Power Electronics and Design, pages 163-168, San Diego, CA, August 16-17 1999.
    • (1999) ACM/IEEE International Symposium on Low Power Electronics and Design , pp. 163-168
    • De, V.1    Borkar, S.2
  • 6
    • 0043136477 scopus 로고    scopus 로고
    • Statistical estimation of leakage-induced power grid voltage drop considering within-die process variations
    • Anaheim, CA, June 2-6
    • I. A. Ferzli and F. N. Najm. Statistical estimation of leakage-induced power grid voltage drop considering within-die process variations. In ACM/IEEE 40th Design Automation Conference, pages 856-869, Anaheim, CA, June 2-6 2003.
    • (2003) ACM/IEEE 40th Design Automation Conference , pp. 856-869
    • Ferzli, I.A.1    Najm, F.N.2
  • 8
    • 0036911849 scopus 로고    scopus 로고
    • Sub-90nm technologies -challenges and opportunities for CAD
    • San Jose, CA, Nov. 10-14
    • T. Karnik, S. Borkar, and V. De. Sub-90nm technologies -challenges and opportunities for CAD. In International Conference on Computer-Aided Design, pages 203-206, San Jose, CA, Nov. 10-14 2002.
    • (2002) International Conference on Computer-aided Design , pp. 203-206
    • Karnik, T.1    Borkar, S.2    De, V.3
  • 18
    • 0031077147 scopus 로고    scopus 로고
    • Analysis and decomposition of spatial variation in integrated circuit processes and devices
    • Feb.
    • B. E. Stine, D. S. Boning, and J. E. Chung. Analysis and decomposition of spatial variation in integrated circuit processes and devices. IEEE Transactions on Semiconductor Manufacturing, 10(1):24-41, Feb. 1997.
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  • 19
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    • John Wiley & Sons, Inc., New York, NY, 2nd edition
    • S. K. Thompson. Sampling. John Wiley & Sons, Inc., New York, NY, 2nd edition, 2002.
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    • Thompson, S.K.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.