-
1
-
-
0035060746
-
Impact of die-to-die and within-die parameter fluctuations on the maximum clock frequency distribution
-
K. A. Bowman, S. G. Duvall, and J. D. Meindl. Impact of die-to-die and within-die parameter fluctuations on the maximum clock frequency distribution. In ISSCC, pages 278-279, 2001.
-
(2001)
ISSCC
, pp. 278-279
-
-
Bowman, K.A.1
Duvall, S.G.2
Meindl, J.D.3
-
2
-
-
0033362679
-
Technology and design challenges for low power and high performance
-
V. De and S. Borkar. Technology and design challenges for low power and high performance. In ISLPED, pages 163-168, 1999.
-
(1999)
ISLPED
, pp. 163-168
-
-
De, V.1
Borkar, S.2
-
3
-
-
0034428063
-
EDA challenges facing future microprocessor design
-
Dec.
-
T. Kam, S. Rawat, D. Kirkpatrick, R. Roy, G. S. Spirakis, N. Sherwani, and C. Peterson. EDA challenges facing future microprocessor design. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 19(12);1498-1506, Dec. 2000.
-
(2000)
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
, vol.19
, Issue.12
, pp. 1498-1506
-
-
Kam, T.1
Rawat, S.2
Kirkpatrick, D.3
Roy, R.4
Spirakis, G.S.5
Sherwani, N.6
Peterson, C.7
-
4
-
-
0036911849
-
Sub-90nm technologies challenges and opportunities for CAD
-
T. Karnik, S. Borkar, and V. De. Sub-90nm technologies challenges and opportunities for CAD. In ICCAD, pages 203-206, 2002.
-
(2002)
ICCAD
, pp. 203-206
-
-
Karnik, T.1
Borkar, S.2
De, V.3
-
5
-
-
0029358733
-
Pattern independent maximum current estimation in power and ground buses of CMOS VLSI circuits: Algorithms, signal correlations, and their resolution
-
August
-
H. Kriplani, F. N. Najm, and I. Hajj. Pattern independent maximum current estimation in power and ground buses of CMOS VLSI circuits: algorithms, signal correlations, and their resolution. IEEE Transactions on Computer-Aided Design, 14(8):998-1012, August 1995.
-
(1995)
IEEE Transactions on Computer-Aided Design
, vol.14
, Issue.8
, pp. 998-1012
-
-
Kriplani, H.1
Najm, F.N.2
Hajj, I.3
-
6
-
-
0003570601
-
-
Prentice-Hall, Inc., 4th edition
-
I. R. Miller, J. E. Freund, and R. Johnson. Probability and Statistics for Engineers. Prentice-Hall, Inc., 4th edition, 1990.
-
(1990)
Probability and Statistics for Engineers
-
-
Miller, I.R.1
Freund, J.E.2
Johnson, R.3
-
7
-
-
0036949325
-
Full-chip sub-threshold leakage power prediction model for sub-0.18um CMOS
-
S. Narendra, V. De, S. Borkar, D. Antoniadis, and A. Chandrakasan. Full-chip sub-threshold leakage power prediction model for sub-0.18um CMOS. In ISLPED, pages 19-23, 2002.
-
(2002)
ISLPED
, pp. 19-23
-
-
Narendra, S.1
De, V.2
Borkar, S.3
Antoniadis, D.4
Chandrakasan, A.5
-
8
-
-
0032272376
-
Within-chip variability analysis
-
S. R. Nassif. Within-chip variability analysis. In IEDM, pages 283-286,1998.
-
(1998)
IEDM
, pp. 283-286
-
-
Nassif, S.R.1
-
11
-
-
0036954781
-
Modeling and analysis of leakage power considering within-die process variations
-
A. Srivastava, R. Bai, D. Blaauw, and D. Sylvester. Modeling and analysis of leakage power considering within-die process variations. In ISLPED, pages 64-67, 2002.
-
(2002)
ISLPED
, pp. 64-67
-
-
Srivastava, A.1
Bai, R.2
Blaauw, D.3
Sylvester, D.4
-
12
-
-
0031077147
-
Analysis and decomposition of spatial variation in integrated circuit processes and devices
-
Feb.
-
B. E. Stine, D. S. Boning, and J. E. Chung. Analysis and decomposition of spatial variation in integrated circuit processes and devices IEEE Transactions on Semiconductor Manufacturing, 10(1):24-41, Feb. 1997.
-
(1997)
IEEE Transactions on Semiconductor Manufacturing
, vol.10
, Issue.1
, pp. 24-41
-
-
Stine, B.E.1
Boning, D.S.2
Chung, J.E.3
-
13
-
-
0004239666
-
-
John Wiley & Sons, Inc., 2nd edition
-
S. K. Thompson. Sampling. John Wiley & Sons, Inc., 2nd edition, 2002.
-
(2002)
Sampling
-
-
Thompson, S.K.1
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