Formation, characterization, and sub-50-nm patterning of organosilane monolayers with embedded disulfide bonds: An engineered self-assembled monolayer resist for electron-beam lithography

Langmuir

Volumn 19, Issue 23, 2003, Pages 9748-9758

  Wang, Xuejun ^a   Hu, Wenchuang ^b   Ramasubramaniam, Rajagopal ^b   Bernstein, Gary H ^b   Snider, Gregory ^b   Lieberman, Marya ^a  

^a UNIVERSITY OF NOTRE DAME   (United States)

^b University of Notre Dame   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHEMICAL BONDS; COMPUTER SIMULATION; ELECTRON BEAM LITHOGRAPHY; FRICTION; LEAST SQUARES APPROXIMATIONS; SELF ASSEMBLY; SILANES; SURFACE TOPOGRAPHY; ULTRATHIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY;

DISULFIDE BONDS; ORGANOSILANE MONOLAYERS; SELF ASSEMBLED MONOLAYERS;

MONOLAYERS;

EID: 0345015944     PISSN: 07437463     EISSN: None     Source Type: Journal    
DOI: 10.1021/la035291e     Document Type: Article

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