Prediction of Thermal Performance of Flip-Chip-Plastic Ball Grid Array (FC-PBGA) Packages: Effect of Die Size

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 369, Issue 7, 2001, Pages 139-148

  Ramakrishna, K ^a   Lee, T Y ^b  

^a MOTOROLA INC   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FREESTREAM VELOCITIES;

COMPUTATIONAL FLUID DYNAMICS; DIES; FLIP CHIP DEVICES; HEAT RESISTANCE; MATHEMATICAL MODELS; PROBLEM SOLVING; THERMAL CONDUCTIVITY;

ELECTRONICS PACKAGING;

EID: 1542747907     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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