|
Volumn , Issue , 1999, Pages 125-132
|
Thermal design for flip chip on board in natural convection
|
Author keywords
[No Author keywords available]
|
Indexed keywords
COMPUTATIONAL FLUID DYNAMICS;
COMPUTER SIMULATION;
ELECTRONICS PACKAGING;
HEAT LOSSES;
HEAT RESISTANCE;
INTEGRATED CIRCUIT LAYOUT;
MATHEMATICAL MODELS;
NATURAL CONVECTION;
PRINTED CIRCUIT BOARDS;
RESISTORS;
THERMAL CONDUCTIVITY OF SOLIDS;
HEAT SPREADERS;
FLIP CHIP DEVICES;
|
EID: 0032641939
PISSN: 10652221
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
Times cited : (16)
|
References (0)
|