Thermal evaluation of standard and power TQFP

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1996, Pages 19-29

  Zhou, T ^a   Hundt, M ^a   Motta, Valter ^a  

^a STMicroelectronics USA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPONENTS; COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; HEAT LOSSES; PLASTICS APPLICATIONS; POWER ELECTRONICS; PRINTED CIRCUIT BOARDS; THERMAL VARIABLES MEASUREMENT; THERMODYNAMIC PROPERTIES;

PLASTIC PACKAGES; POWER PACKAGE COPPER SLUG; TEMPERATURE DROP; THERMAL MANAGEMENT; THERMAL PATHS; THERMAL PERFORMANCE; THERMAL RESISTANCE; THERMAL VIAS;

ELECTRONICS PACKAGING;

EID: 0029718665     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)