Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 1997-M, Issue , 1997, Pages 13-21

  Ramakrishna, K ^a   Trent, J R ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOBILES; BALL GRID ARRAYS; CHIP SCALE PACKAGES; COMPUTATIONAL FLUID DYNAMICS; DIE CASTING; ELECTRIC LOSSES; HEAT TRANSFER; MOLDS; PACKAGING; TEMPERATURE; THERMAL CONDUCTIVITY; THERMAL MANAGEMENT (ELECTRONICS);

AMBIENTS; AUTOMOTIVE APPLICATIONS; CONJUGATE HEAT TRANSFER PROBLEM; JUNCTION TEMPERATURES; MOLD COMPOUNDS; PACKAGE TECHNOLOGIES; PLASTIC BALL GRID ARRAYS; POWER-DISSIPATION; TECHNOLOGY SOLUTIONS; THERMAL PERFORMANCE;

DIES;

EID: 0002784474     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE1997-1210     Document Type: Conference Paper

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