Thermal evaluation of gaas-based RF power amplifier packages for handheld portable applications

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 2000-X, Issue , 2000, Pages 413-423

  Adams, V H ^a   Lee, T Y Tom ^b   Hause, J V ^b  

^a MOTOROLA INC   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIES; HEAT FLUX; III-V SEMICONDUCTORS; INFRARED IMAGING; POWER AMPLIFIERS; PRINTED CIRCUIT BOARDS; SEMICONDUCTING GALLIUM; THERMAL CONDUCTIVITY;

CIRCUIT CONFIGURATIONS; DIE SIZE; DIE-ATTACH; GAAS; HANDHELDS; PORTABLE APPLICATIONS; POWER DISTRIBUTIONS; RF POWER AMPLIFIERS; THERMAL EVALUATIONS; THERMAL PERFORMANCE;

GALLIUM ARSENIDE;

EID: 85119880020     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2000-1837     Document Type: Conference Paper

References (15)

1. thElectronic Components and Technology Conference (ECTC), pp. 63-66.
2. th Electronic Components and Technology Conference (ECTC), pp. 845-859.
3. Guenin, B. M., Chowdhury, A. R., Groover, R. L., and Derian, E., 1996, "Analysis of Thermally Enhanced SOIC Packages", IEEE Trans. Comp., Pkg., Manuf., Techn., Part A, V. 19, pp. 458-468.
4. thElectronic Components and Technology Conference (ECTC), pp. 338-342.
5. EIA/JEP 95, JEDEC Solid State Product Outline MO-220, 2000, "Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Quad Flat No Lead Package", Electronic Industries Association, Engineering Department, Arlington, VA.
6. MRFIC1859, Dual-Band GSM 3.6V IPA, Motorola Semiconductor Technical Data (http:Wmot-sps.com/rf/sghtml), 2000.
7. EIA/JESD51-7, 1999, "High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages" and EIA/JESD51-5, "Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanism", Electronic Industries Association, Engineering Department, Arlington, VA.
8. EIA/JESD51-2, 1995, "Integrated Circuit Thermal Test Method Environmental Conditions - Natural Convection (Still Air) ", Electronic Industries Association, Engineering Department, Arlington, VA.
9. ®Version 2.2, 1999, Flomerics Ltd., Surrey England.
10. Adams, V., Ramakrishna, K., Lee, T-Y., Hause, J. V, and Mahalingam, M., 1999, "Design-based Thermal Performance Evaluation of a GaAs MMIC Device in a Plastic Ball Grid Array Package", Proc. Inter-Society Electronic Packaging Conference (InterPACK '99), EEP-Vol. 26-1, pp. 277-285.
11. Ramakrishna, K. and Trent, J. R., "Evaluation of Thermal Performance of a Three Chip, Single Package Technology Solution for Automotive Applications", CAD/CAE and Thermal Management Issues in Electronic Systems, Vol. 1, D. Agonafer et al. (editors), ASME Electrical & Electronic Packaging Division, pp. 13-21, 1997.
12. Johnson, Z., Ramakrishna, K., Joiner, B., and Eyman, M., 1997, "Thermal Sub-modeling of Wirebonded Plastic Ball Grid Array Package", Proc. Thirteenth Semi-Therm Symp., Austin, TX, pp. 1-9.
13. thedition, Harper & Row Publishers, New York, NY.
14. CINDAS Material Property Database, 1997, Purdue University, West Lafayette, IN.
15. Thermal Vision 900 Series User Manual, 1994, Publication No. 557-020 Ed. No. 1, FLIR Systems, Inc., Danderyd, Sweden.