Design-based Thermal Performance Evaluation of a GaAs MMIC Device in a Plastic Ball Grid Array Package

American Society of Mechanical Engineers, EEP

Volumn 26 3, Issue , 1999, Pages 277-285

  Adams, V H ^a   Ramakrishna, K ^a   Lee, T Y Tom ^b   Hause, J V ^b   Mahalingam, M ^b  

^a MOTOROLA INC   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0346402824     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (12)

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2. Chien, D., Lee, C., Rachlin, M., Peake, A., and Kole, T., 1996. "Thermal Analysis and Measurement of Plastic Packaged GaAs Devices," Proc. Twelfth IEEE SEMI-THERM Symp., pp. 89-96.
3. CINDAS Material Property Database, 1997, Purdue University, West Lafayette, IN.
4. Fan, M., Christou, A., and Pecht, M., 1992, "Two-dimensional Thermal Modeling of Power monolithic Microwave Integrated Circuits (MMICs)," IEEE Trans. Electron Dev., v. 39, pp. 1075-1079.
5. Flotherm Reference Manual, Vl.4, 1995, Document number: FLOTHERM/RM/0394/1/3, version 1.4 (36), Flomerics Ltd., Surrey, England.
6. Johnson, Z., Ramakrishna, K., Joiner, B., and Eyman, M., 1997. "Thermal Sub-modeling of the Wirebonded Plastic Ball Grid Array," Proc. Thirteenth IEEE SEMI-THERM Symp., pp. 1-9.
7. Kreith, F., and Bohn, M. S., 1986, "Principles of Heat Transfer," 4th edition, Harper & Row Publishers, New York, NY.
8. Lee, T.Y. and Hause, V., 1998, "Thermal Measurements of IQME GaAs PBGA Package," Motorola Internal Report., Embedded Systems Laboratories, SPS, Motorola, Inc, Tempe, AZ.
9. Nishihori, K., Ishida, K., Kitaura, Y., and Uchitomi, N., 1997, "Thermal Analysis of GaAs Power Monolithic Microwave IC's Mounted with Epoxy Attachment," IEEE Trans. Comp., Pkg., and Manuf. Techn. - Part A, v. 20, pp. 220-224.
10. Ramakrishna, K., and Trent, J. R., 1997, "Parametric Study of Thermal Performance of a Three Chip, Single Package Technology for Automotive Applications," in "CAD/CAE and Thermal Management Issues in Electronic Systems" D. Agonafer, (editor), ASME Electrical & Electronic Packaging Division, pp. 13-21, EEP-Vol. 23 & HTD-Vol. 356, Presented at the 1997 ASME International Mechanical Engineering Conference & Exposition held in Dallas, TX (November 16-21, 1997).
11. Thermal Vision 900 Series User Manual, 1994, Publication No. 557-020 Ed. No. 1, FLIR Systems, Inc, Danderyd, Sweden.
12. Webb, P., "Thermal Modeling of Power Gallium Arsenide Microwave Integrated Circuits," IEEE Trans. Electron Dev., v. 40, pp. 867-877.