-
3
-
-
0033940113
-
-
Liu, G.-Y.; Xu, S.; Qian, Y. Acc. Chem. Res. 2000, 33, 457-466.
-
(2000)
Acc. Chem. Res.
, vol.33
, pp. 457-466
-
-
Liu, G.-Y.1
Xu, S.2
Qian, Y.3
-
4
-
-
0033614026
-
-
(a) Piner, R. D.; Zhu, J.; Xu, F.; Hong, S.; Mirkin, C. A. Science 1999, 283, 661-663.
-
(1999)
Science
, vol.283
, pp. 661-663
-
-
Piner, R.D.1
Zhu, J.2
Xu, F.3
Hong, S.4
Mirkin, C.A.5
-
5
-
-
0008683988
-
-
(b) Mirkin, C. A. MRS Bull. 2001, 26, 535-538.
-
(2001)
MRS Bull.
, vol.26
, pp. 535-538
-
-
Mirkin, C.A.1
-
6
-
-
0141786836
-
-
(c) Zhang, H.; Chung, S.-W.; Mirkin, C. A. Nano Lett. 2003, 3, 43-45.
-
(2003)
Nano Lett.
, vol.3
, pp. 43-45
-
-
Zhang, H.1
Chung, S.-W.2
Mirkin, C.A.3
-
7
-
-
0030570065
-
-
(a) Chou, S. Y.; Krauss, P. R.; Renstrom, P. J. Science 1996, 272, 85-87.
-
(1996)
Science
, vol.272
, pp. 85-87
-
-
Chou, S.Y.1
Krauss, P.R.2
Renstrom, P.J.3
-
8
-
-
0037707232
-
-
(b) Chou, S. Y. MRS Bull. 2001, 26, 512-517.
-
(2001)
MRS Bull.
, vol.26
, pp. 512-517
-
-
Chou, S.Y.1
-
9
-
-
0141674950
-
-
(c) McAlpine, M. C.; Friedman, R. S.; Lieber, C. M. Nano Lett. 2003, 3, 443-445.
-
(2003)
Nano Lett.
, vol.3
, pp. 443-445
-
-
McAlpine, M.C.1
Friedman, R.S.2
Lieber, C.M.3
-
10
-
-
0346704264
-
-
Xia, Y.; Rogers, J. A.; Paul, K. E.; Whitesides, G. M. Chem. Rev. 1999, 99, 1823-1848.
-
(1999)
Chem. Rev.
, vol.99
, pp. 1823-1848
-
-
Xia, Y.1
Rogers, J.A.2
Paul, K.E.3
Whitesides, G.M.4
-
11
-
-
0037418895
-
-
Melosh, N. A.; Boukai, A.; Diana, F.; Gerardot, B.; Badolato, A.; Petroff, P. M.; Heath, J. R. Science 2003, 300, 112-115.
-
(2003)
Science
, vol.300
, pp. 112-115
-
-
Melosh, N.A.1
Boukai, A.2
Diana, F.3
Gerardot, B.4
Badolato, A.5
Petroff, P.M.6
Heath, J.R.7
-
15
-
-
1842289819
-
-
(a) Park, M.; Harrison, C.; Chaikin, P. M.; Register, R. A.; Adamson, D. H. Science 1997, 276, 1401-1404.
-
(1997)
Science
, vol.276
, pp. 1401-1404
-
-
Park, M.1
Harrison, C.2
Chaikin, P.M.3
Register, R.A.4
Adamson, D.H.5
-
16
-
-
0035832840
-
-
(b) Park, M.; Chaikin, P. M.; Register, R. A.; Adamson, D. H. Appl. Phys. Lett. 2001, 79, 257-259.
-
(2001)
Appl. Phys. Lett.
, vol.79
, pp. 257-259
-
-
Park, M.1
Chaikin, P.M.2
Register, R.A.3
Adamson, D.H.4
-
17
-
-
0141439770
-
-
note
-
Silicon NWs were dispersed in a solution of isooctane and 2-propanol (3: 1 v/v ratio) containing 50 μL of 5mM 1-octadecylamine in hexane per 1 mL of suspension. The NW suspension with surfactant (about 2.4 mL) was added dropwise to the center of the water surface of a Langmuir-Blodgett trough (KSV 5000 system, KSV Instruments Ltd), and then compressed to a surface pressure between 55 and 60 mN/m. Constant surface pressure was then maintained as the 1-octadecylamine slowly dissolves into the water subphase by reducing the surface area between the L-B barriers. The compression process was stopped when the desired surface area was reached, and then parallel SiNWs were horizontally transferred using the Langmuir-Schaefer method onto Si substrates.
-
-
-
-
19
-
-
0037038368
-
-
Lauhon, L. J.; Gudiksen, M. S.; Wang, D.; Lieber, C. M. Nature 2002, 420, 57-61.
-
(2002)
Nature
, vol.420
, pp. 57-61
-
-
Lauhon, L.J.1
Gudiksen, M.S.2
Wang, D.3
Lieber, C.M.4
-
20
-
-
0035831837
-
-
Cui, Y.; Lauhon, L. J.; Gudiksen, M. S.; Wang, J.; Lieber, C. M. Appl. Phys. Lett. 2001, 78, 2214-2216.
-
(2001)
Appl. Phys. Lett.
, vol.78
, pp. 2214-2216
-
-
Cui, Y.1
Lauhon, L.J.2
Gudiksen, M.S.3
Wang, J.4
Lieber, C.M.5
-
21
-
-
21844496315
-
-
Bell, F. H.; Joubert, O.; Oehrlein, G. S.; Zhang, Y.; Vender, D. J. Vac. Sci. Technol. A 1994, 12, 3095-3101.
-
(1994)
J. Vac. Sci. Technol. A
, vol.12
, pp. 3095-3101
-
-
Bell, F.H.1
Joubert, O.2
Oehrlein, G.S.3
Zhang, Y.4
Vender, D.5
-
22
-
-
0141439768
-
-
note
-
RIE was carried out with a South Bay Technology reactive ion etcher (RIE2000) using trifluoromethane at a flow rate of 50 sccm and a pressure of 30 mTorr. Under the power of 75 W and DC bias of -820 V, the etching rate of silica is about 60 nm/min. Etching selectivity of silica over silicon is not optimized but is sufficient for the current study.
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-
-
-
23
-
-
0030231509
-
-
Albrecht, O.; Matsuda, H.; Eguchi, K.; Nakagiri, T. Thin Solid Films 1996, 284-285, 152-156.
-
(1996)
Thin Solid Films
, vol.284-285
, pp. 152-156
-
-
Albrecht, O.1
Matsuda, H.2
Eguchi, K.3
Nakagiri, T.4
-
24
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0141439769
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note
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The length of the NWs sets a natural length scale for continuous line features produced by our method, and structures much larger than this length will naturally have "broken line" defects. In this regard, our hierarchical patterning represents a good method for controlling the defects; that is, using arrays comparable to or smaller than the average length of the NWs.
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