Electrical and plasma property measurements of a deep reactive ion etching Bosch process

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 21, Issue 3, 2003, Pages 1112-1119

  Abraham, I C ^a   Woodworth, J R ^a   Riley, M E ^a   Miller, P A ^a   Shul, R J ^a   Willison, C G ^b  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b L and M Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; MICROMACHINING; PLASMA DENSITY; PLASMA OSCILLATIONS;

BOSCH PROCESS;

REACTIVE ION ETCHING;

EID: 0038456956     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1565145     Document Type: Article

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