Effect of nitrogen content in TaNx (x = 0-1) barrier substrates on electroless copper deposition

Electrochemical and Solid-State Letters

Volumn 5, Issue 12, 2002, Pages

  Hong, Seok Woo ^a   Park, Jong Wan ^a  

^a Hanyang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROLESS PLATING; GRAIN BOUNDARIES; NITROGEN; PALLADIUM; POLYCRYSTALLINE MATERIALS; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; TANTALUM COMPOUNDS; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

POLYCRYSTALLINE FILMS;

ELECTROCHEMISTRY;

EID: 0036898715     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1516908     Document Type: Article

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