메뉴 건너뛰기




Volumn 47, Issue 1, 2003, Pages 71-76

Structural dependence of breakdown characteristics and electrical degradation in ultrathin RPECVD oxide/nitride gate dielectrics under constant voltage stress

Author keywords

Constant voltage stress; Dielectric degradation; Hard breakdown; RPECVD oxide nitride dielectric; Soft breakdown; Stress induced leakage current

Indexed keywords

ELECTRIC BREAKDOWN; HOLE TRAPS; INTERFACES (MATERIALS); LEAKAGE CURRENTS; NITRIDES; NITRIDING; OXIDES; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; STRESS ANALYSIS; THRESHOLD VOLTAGE;

EID: 0037211182     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0038-1101(02)00257-5     Document Type: Article
Times cited : (6)

References (22)
  • 1
    • 0029289815 scopus 로고
    • High field related thin oxide wearout and breakdown
    • Dumin D.et al. High field related thin oxide wearout and breakdown. IEEE Trans. Electron Dev. 42(4):1995;760.
    • (1995) IEEE Trans. Electron Dev. , vol.42 , Issue.4 , pp. 760
    • Dumin, D.1
  • 2
    • 0028755085 scopus 로고
    • Quasi-breakdown of ultrathin gate oxide under high field stress
    • Lee S.et al. Quasi-breakdown of ultrathin gate oxide under high field stress. IEEE IEDM Tech. Dig. 1994;605-608.
    • (1994) IEEE IEDM Tech. Dig. , pp. 605-608
    • Lee, S.1
  • 3
    • 0011790942 scopus 로고    scopus 로고
    • Experimental evidence of interface-controlled mechanism of quasi-breakdown in ultrathin gate oxide
    • Guan H.et al. Experimental evidence of interface-controlled mechanism of quasi-breakdown in ultrathin gate oxide. IEEE Trans. Electron Dev. 48(2):1997;317-323.
    • (1997) IEEE Trans. Electron Dev. , vol.48 , Issue.2 , pp. 317-323
    • Guan, H.1
  • 4
    • 84886448127 scopus 로고    scopus 로고
    • Ultra-thin gate dielectrics: They break down, but do they fail?
    • Weir B.et al. Ultra-thin gate dielectrics: they break down, but do they fail? IEEE, IEDM Tech. Dig. 1997;73-76.
    • (1997) IEEE, IEDM Tech. Dig. , pp. 73-76
    • Weir, B.1
  • 5
    • 4243914953 scopus 로고    scopus 로고
    • Degradation of ultra-thin gate oxides accompanied by hole direct tunneling. Can we keep long-term reliability of p-MOSFETs?
    • Deguchi K.et al. Degradation of ultra-thin gate oxides accompanied by hole direct tunneling. Can we keep long-term reliability of p-MOSFETs? IEEE, IEDM Tech. Dig. 1997;73-76.
    • (1997) IEEE, IEDM Tech. Dig. , pp. 73-76
    • Deguchi, K.1
  • 6
    • 0033331072 scopus 로고    scopus 로고
    • Soft breakdown in ultra-thin oxides
    • Weir B.E.et al. Soft breakdown in ultra-thin oxides. Mat. Res. Soc. Symp. Proc. 567:1999.
    • (1999) Mat. Res. Soc. Symp. Proc. , vol.567
    • Weir, B.E.1
  • 7
    • 0000902506 scopus 로고    scopus 로고
    • Soft breakdown triggers for large area capacitors under constant voltage stress
    • J. Schmitz et al. Soft breakdown triggers for large area capacitors under constant voltage stress. IEEE, IRPS-2001. p. 393-98.
    • IEEE, IRPS-2001 , pp. 393-398
    • Schmitz, J.1
  • 8
    • 0032266438 scopus 로고    scopus 로고
    • Structure dependence of dielectric breakdown in ultra-thin gate oxides and its relationship to soft breakdown modes and device failure
    • Wu E.et al. Structure dependence of dielectric breakdown in ultra-thin gate oxides and its relationship to soft breakdown modes and device failure. IEEE IEDM Tech. Dig. 1998;187-190.
    • (1998) IEEE IEDM Tech. Dig. , pp. 187-190
    • Wu, E.1
  • 9
    • 0033732597 scopus 로고    scopus 로고
    • 2 films: Occurrence characterization and reliability assessment methodology
    • 2 films: Occurrence characterization and reliability assessment methodology. IEEE, IRPS-2000. p. 48-54.
    • IEEE, IRPS-2000 , pp. 48-54
    • Bruyere, S.1
  • 10
    • 0032204912 scopus 로고    scopus 로고
    • On the properties of the gate and substrate current after soft breakdown in ultrathin oxide layers
    • Crupi F.et al. On the properties of the gate and substrate current after soft breakdown in ultrathin oxide layers. IEEE Trans. Electron Dev. 45(11):1998;2329.
    • (1998) IEEE Trans. Electron Dev. , vol.45 , Issue.11 , pp. 2329
    • Crupi, F.1
  • 11
    • 0033880145 scopus 로고    scopus 로고
    • Soft breakdown conduction in ultrathin (3-5 nm) gate dielectrics
    • Miranda E.et al. Soft breakdown conduction in ultrathin (3-5 nm) gate dielectrics. IEEE Trans Electron Dev. 47(1):2000;82-89.
    • (2000) IEEE Trans Electron Dev , vol.47 , Issue.1 , pp. 82-89
    • Miranda, E.1
  • 12
    • 0029184921 scopus 로고
    • Three hot-carrier degradation mechanisms in deep-submicron PMOSFETs
    • Woltjer R.et al. Three hot-carrier degradation mechanisms in deep-submicron PMOSFETs. IEEE Trans Electron Dev. 42(1):1995;109.
    • (1995) IEEE Trans Electron Dev , vol.42 , Issue.1 , pp. 109
    • Woltjer, R.1
  • 13
    • 0028735420 scopus 로고
    • Reliability characteristics and surface preparation technique for ultra-thin (33 A-87 A) oxides and oxynitrides
    • Hao M.et al. Reliability characteristics and surface preparation technique for ultra-thin (33 A-87 A) oxides and oxynitrides. IEEE IEDM Tech. Dig. 1994;601-604.
    • (1994) IEEE IEDM Tech. Dig. , pp. 601-604
    • Hao, M.1
  • 14
    • 0011756187 scopus 로고    scopus 로고
    • Impact of interface nitridation and remote-plasma-assisted oxidation (RPAO) thickness on breakdown phenomena and reliability of stacked oxide/nitride and oxynitride dielectrics under constant voltage stress
    • Philadelphia
    • Lee Y., et al. Impact of interface nitridation and remote-plasma-assisted oxidation (RPAO) thickness on breakdown phenomena and reliability of stacked oxide/nitride and oxynitride dielectrics under constant voltage stress, The Electrochemical Society (ECS) 201st Meeting, Philadelphia, 2002.
    • (2002) The Electrochemical Society (ECS) 201st Meeting
    • Lee, Y.1
  • 15
    • 0034227480 scopus 로고    scopus 로고
    • 2 interface s prepared by remote plasma enhanced CVD and post-deposition rapid thermal annealing
    • 2 interface s prepared by remote plasma enhanced CVD and post-deposition rapid thermal annealing. IEEE Trans Electron Dev. 47(7):2000;1361-1369.
    • (2000) IEEE Trans Electron Dev , vol.47 , Issue.7 , pp. 1361-1369
    • Wu, Y.1
  • 17
    • 0011729195 scopus 로고    scopus 로고
    • Intrinsic reliability projections for a thin JVD silicon nitride gate dielectric in p-MOSFET
    • Polishchuk I.et al. Intrinsic reliability projections for a thin JVD silicon nitride gate dielectric in p-MOSFET. IEEE Trans Dev Mater Reliab. 1(1):2001.
    • (2001) IEEE Trans Dev Mater Reliab , vol.1 , Issue.1
    • Polishchuk, I.1
  • 18
    • 0033731019 scopus 로고    scopus 로고
    • Experimental analysis of gate oxide degradation
    • Yamada R. et al. Experimental analysis of gate oxide degradation. IEEE, IRPS-2000. p. 65-71.
    • IEEE, IRPS-2000 , pp. 65-71
    • Yamada, R.1
  • 20
    • 0028531198 scopus 로고
    • Positive oxide-charge generation during 0.25 μ m PMOSFET hot-carrier degradation
    • Woltjer R.et al. Positive oxide-charge generation during 0.25. μ m PMOSFET hot-carrier degradation IEEE Electron Dev. Lett. 15(10):1994;427.
    • (1994) IEEE Electron Dev. Lett. , vol.15 , Issue.10 , pp. 427
    • Woltjer, R.1
  • 21
    • 33747905416 scopus 로고    scopus 로고
    • Relation between breakdown mode and location in short-channel nMOSFETs and its impact on reliability specifications
    • Degraeve R.et al. Relation between breakdown mode and location in short-channel nMOSFETs and its impact on reliability specifications. IEEE Trans Dev Mater Reliab. 1(3):2001;163-169.
    • (2001) IEEE Trans Dev Mater Reliab , vol.1 , Issue.3 , pp. 163-169
    • Degraeve, R.1
  • 22
    • 0000171167 scopus 로고    scopus 로고
    • Conduction mechanism under quasibreakdown of ultrathin gate oxide
    • He Y.et al. Conduction mechanism under quasibreakdown of ultrathin gate oxide. Appl. Phys. Lett. 75:1999;2432-2434.
    • (1999) Appl. Phys. Lett. , vol.75 , pp. 2432-2434
    • He, Y.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.