Cavity pressure control for critical damping of packaged micro mechanical devices

International Conference on Solid-State Sensors and Actuators, and Eurosensors IX, Proceedings

Volumn 1, Issue , 1995, Pages 240-243

  Minami, Kazuyuki ^a   Moriuchi, Terumi ^a   Esashi, Masayoshi ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; DAMPING; ETCHING; HYDRAZINE; INERT GASES; PRESSURE CONTROL; PRESSURE GAGES; SEMICONDUCTING GLASS; SILICON WAFERS; VACUUM TECHNOLOGY;

ANODIC BONDING; CRITICAL DAMPING; FREQUENCY RANGE; GLASS SILICON STRUCTURE; NONEVAPORABLE GETTERS; PACKAGED MICROMECHANICAL DEVICES; SILICON DIAPHRAGMS; VACUUM CHAMBERS; VACUUM PACKAGING METHOD;

MICROELECTROMECHANICAL DEVICES;

EID: 0029511837     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)