A new transferred ultra-thin silicon micropackaging

Journal of Micromechanics and Microengineering

Volumn 12, Issue 4, 2002, Pages 406-409

  Chen, Jen Yi ^a   Huang, Long Sun ^b   Chu, Chia Hua ^b   Peizen, Chang ^b  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; MICROELECTROMECHANICAL DEVICES; MICROELECTRONIC PROCESSING; MICROMACHINING; THREE DIMENSIONAL;

HERMETIC SEALING; MICROPACKAGING; TETHER BROKEN TECHNIQUE; ULTRATHIN SILICON;

SILICON WAFERS;

EID: 0036645827     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/12/4/310     Document Type: Article

References (10)

1. Ultra-thin ICs open new dimensions for microelectronic system
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5. Vacuum encapsulation of resonant devices using permeable polysilicon
6. Vacuum packaging technology using localized aluminum silicon-to-glass bonding
7. Batch micropackaging by compression-bonded wafer-wafer transfer
8. Overview and development trends in the field of MEMS packaging
9. Batch transfer of microstructures using flip-chip solder bump bonding