Ultra thin ICs open new dimensions for microelectronic systems

Advancing Microelectronics

Volumn 27, Issue 4, 2000, Pages 23-25

  Klink, G ^a   Landesberger, C ^a   Feil, M ^a   Ansorge, F ^a   Aschenbrenner, R ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001851640     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

1. Savastiouk, Sergey et. al., Advanced Packaging 7, Sept. 1998, pp. 55-58
2. Ramm, Peter et. al.: "Three dimensional metallization for vertically integrated circuits." Microelectronic Engineering 37/38, 1997, pp. 39-47
3. C. Landesberger, M. Feil, A. Klumpp, E. Hacker: "Verfahren zum Vereinzeln eines Wafers," German patent 199 62 763.
4. Feil, Michael: "Method for Contacting a Circuit Chip," Patent application PCT/EP99/06311, 1998
5. Feil, Michael et al.: "Verfahren zur Herstellung eines Transponders," Patent application AK198 48 821.1, 1998
6. K. Haberger: "Papier mit integrierter Schaltung," German patent application DE 196 01 358.5
7. C. Landesberger, P. Ramm, H. Reichl, F. Ansorge, O. Ehrmann: "Multi-Chip-Modul und Verfahren zum Herstellen eines MultiChip-Moduls, " German patent 100 11 005.3