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Volumn 41, Issue 6 B, 2002, Pages 4146-4149
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Influence of silicon on insulator wafer stress properties on placement accuracy of stencil masks
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Author keywords
Ion projection lithography; Next generation lithography; Stencil masks; Stress engineering
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Indexed keywords
BONDING;
ERROR ANALYSIS;
FINITE ELEMENT METHOD;
LITHOGRAPHY;
MEMBRANES;
SILICON ON INSULATOR TECHNOLOGY;
SILICON WAFERS;
STRESS ANALYSIS;
NEXT GENERATION LITHOGRAPHY (NGL);
MASKS;
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EID: 0036614057
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/jjap.41.4146 Document Type: Article |
Times cited : (6)
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References (15)
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