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Journal of the Electrochemical Society

Volumn 149, Issue 4, 2002, Pages

Effect of a Au overlayer on thermal stability of Pt transparent ohmic contact on p-Type GaN

(2) Kim, Jong Kyu a Lee, Jong Lam a

a Pohang University of Science and Technology (POSTECH) (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CURRENT VOLTAGE CHARACTERISTICS; ELECTRIC RESISTANCE; GALLIUM NITRIDE; GOLD; MICROSTRUCTURE; PLATINUM; SECONDARY ION MASS SPECTROMETRY; SEMICONDUCTING FILMS; THERMODYNAMIC STABILITY; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

GALLIUM NITRIDE FILM; GOLD OVERLAYER; OHMIC CONTACT RESISTIVITY; THERMALLY STABLE OHMIC CONTACT; TRANSMISSION LINE METHOD;

OHMIC CONTACTS;

EID: 0036530385 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.1456924 Document Type: Article

Times cited : (9)

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