Real time resistivity measurements during sputter deposition of ultrathin copper films

Journal of Applied Physics

Volumn 91, Issue 3, 2002, Pages 1667-1672

  Barnat, E V ^a,b   Nagakura, D ^a,b   Wang, P I ^a,b   Lu, T M ^a,b  

^a Rensselaer Polytechnic Institute   (United States)

^b RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AVERAGE GRAIN SIZE; ELECTRICAL RESISTIVITY; EX-SITU ATOMIC FORCE MICROSCOPY; MEAN FREE PATH; MODEL FIT; REAL TIME; RESISTIVITY MEASUREMENT; ROOM TEMPERATURE; THIN COPPER FILMS; TIME-SCALES; ULTRATHIN COPPER FILMS;

ATOMIC FORCE MICROSCOPY; SILICA; TRANSMISSION ELECTRON MICROSCOPY;

ELECTRIC CONDUCTIVITY;

EID: 0036470595     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1430530     Document Type: Article

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