Cu wetting and interfacial stability on clean and nitrided tungsten surfaces

Applied Surface Science

Volumn 171, Issue 3-4, 2001, Pages 275-282

  Ekstrom, B M ^a   Lee, S ^a   Magtoto, N ^a   Kelber, J A ^a  

^a UNIVERSITY OF NORTH TEXAS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; CHEMICAL CLEANING; GROWTH (MATERIALS); INTERFACES (MATERIALS); NITRIDING; NUCLEATION; THERMOANALYSIS; TUNGSTEN; VACUUM; WETTING;

THERMAL DESORPTION SPECTROSCOPY (TDS);

COPPER;

EID: 0035252426     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(00)00816-3     Document Type: Article

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