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Diamond and Related Materials

Volumn 10, Issue 2, 2001, Pages 234-239

Amorphous carbon based materials as the interconnect dielectric in ULSI chips

(1) Grill, A a

a IBM T J WATSON RESEARCH CENTER (United States)

Author keywords

Amorphous carbon; Dielectric; DLC; ULSI chips

Indexed keywords

CARBON; DIELECTRIC MATERIALS; ELECTRIC CONDUCTIVITY OF SOLIDS; METALLIZING; MICROPROCESSOR CHIPS; PERMITTIVITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; THERMODYNAMIC STABILITY; ULSI CIRCUITS;

AMORPHOUS CARBON; DIAMOND LIKE CARBON FILMS; INTERCONNECT METALLIZATION;

AMORPHOUS FILMS;

CARBON; DIELECTRIC PROPERTY;

EID: 0035248170 PISSN: 09259635 EISSN: None Source Type: Journal
DOI: 10.1016/S0925-9635(00)00473-8 Document Type: Article

Times cited : (81)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.