Copper electromigration modeling including barrier layer effect

Solid-State Electronics

Volumn 45, Issue 12, 2001, Pages 2011-2016

  Wu, W ^a   Yuan, J S ^a  

^a University of Central Florida   (United States)

Author keywords

Barrier layer effect; Continuity equation; Copper electromigration; Interconnect lifetime; Pulse DC stress; Reduced vacancy concentration

Indexed keywords

CHARGE CARRIERS; COPPER; DIELECTRIC FILMS; ELECTRIC FIELD EFFECTS; ELECTROMIGRATION; MATHEMATICAL MODELS; STRESSES;

BARRIER LAYER EFFECTS;

ELECTRIC CONNECTORS;

EID: 0035545643     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0038-1101(01)00217-9     Document Type: Article

References (22)

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