Review of planarization and reliability aspects of future interconnect materials

Journal of Electronic Materials

Volumn 25, Issue 10, 1996, Pages 1617-1622

  Sethuraman, Anantha R ^a   Wang, Jiun Fang ^a   Cook, Lee M ^a  

^a ROHM AND HAAS COMPANY   (United States)

Author keywords

Aluminum; Chemical mechanical polishing; Copper; Interconnects

Indexed keywords

EID: 0002668081     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02655585     Document Type: Review

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