-
1
-
-
84937650904
-
Electromigration - A brief survey and some recent results
-
J. R. Black, "Electromigration - A brief survey and some recent results," IEEE Trans. Electron Devices, vol. ED-16, pp. 338-343, 1969.
-
(1969)
IEEE Trans. Electron Devices
, vol.16 ED
, pp. 338-343
-
-
Black, J.R.1
-
2
-
-
0025435021
-
Projecting interconnect electromigration lifetimes for arbitrary current waveforms
-
B.-K. Liew, NL W. Cheung, and C. Hu, "Projecting interconnect electromigration lifetimes for arbitrary current waveforms," IEEE Tram. Electron Devices, vol. 37, pp. 1343-1351, 1990.
-
(1990)
IEEE Tram. Electron Devices
, vol.37
, pp. 1343-1351
-
-
Liew, B.-K.1
Cheung, N.L.W.2
Hu, C.3
-
3
-
-
0026954492
-
Circuit reliability for interconnect, via and contact electromigation
-
B.-K. Liew. P. Fang, N. W. Cheung, and C. Hu, ''Circuit reliability for interconnect, via and contact electromigation," IEEE Trans. Electron Devices, vol. 39, pp. 2472-2479, 1993.
-
(1993)
IEEE Trans. Electron Devices
, vol.39
, pp. 2472-2479
-
-
Liew, B.-K.1
Fang, P.2
Cheung, N.W.3
Hu, C.4
-
4
-
-
0027646077
-
Electromigration reliability of tungsten and aluminum vias and interconnects under AC current stress
-
J. Tao, K. K. Konrad, N. W. Cheung, and C. IIu, "Electromigration reliability of tungsten and aluminum vias and interconnects under AC current stress," IEEE Trans. Electron Devices, vol. 40, pp. 1398-1403, 1993.
-
(1993)
IEEE Trans. Electron Devices
, vol.40
, pp. 1398-1403
-
-
Tao, J.1
Konrad, K.K.2
Cheung, N.W.3
Iiu, C.4
-
5
-
-
0000697090
-
A model for conductor failure considering diffusion concurrently with electromigration, resulting in a current exponent of two
-
M. Shatskes and J. R. Eloyd, "A model for conductor failure considering diffusion concurrently with electromigration, resulting in a current exponent of two." J. Appl. Phys., vol. 59, pp. 3890-3893, 1986.
-
(1986)
J. Appl. Phys.
, vol.59
, pp. 3890-3893
-
-
Shatskes, M.1
Eloyd, J.R.2
-
6
-
-
36449003103
-
Numerical investigations of the electromigration boundary value problem
-
J. J. Clement and L R. Lloyd, "Numerical investigations of the electromigration boundary value problem," J. Appl. Phys., vol. 71, pp. 1729-1731, 1992.
-
(1992)
J. Appl. Phys.
, vol.71
, pp. 1729-1731
-
-
Clement, J.J.1
Lloyd, L.R.2
-
7
-
-
0000268479
-
Vacancy supersaturation model for electromigration failure under dc and pulsed dc stress
-
J. J. Clement, "Vacancy supersaturation model for electromigration failure under dc and pulsed dc stress," J. Appl. Phys., vol. 71, pp. 4262-41268, 1992.
-
(1992)
J. Appl. Phys.
, vol.71
, pp. 4262-41268
-
-
Clement, J.J.1
-
8
-
-
0004582524
-
Electromigration induced vacancy behavior in unpassivated thin films
-
J. R. Lloyd and R. Koch, "Electromigration induced vacancy behavior in unpassivated thin films," J. Appl. Phys., vol. 71, pp. 3231-3233, 1992.
-
(1992)
J. Appl. Phys.
, vol.71
, pp. 3231-3233
-
-
Lloyd, J.R.1
Koch, R.2
-
9
-
-
0012679538
-
Electromigration failure
-
J. R. Lloyd. "Electromigration failure," 7. Appl. Phys., vol. 69, pp. 7601-7604, 1991.
-
(1991)
Appl. Phys.
, vol.69
, pp. 7601-7604
-
-
Lloyd, J.R.1
-
10
-
-
0002667511
-
Electromigration failure in a finite conductor with a single blocking boundary
-
[101 V. M. Dwycr, F.-S. Wang, and P. Donaldson, "Electromigration failure in a finite conductor with a single blocking boundary," J. Appl Phys., vol. 76, pp. 7305-7310, 1994.
-
(1994)
J. Appl Phys.
, vol.76
, pp. 7305-7310
-
-
Dwycr, V.M.1
Wang, F.-S.2
Donaldson, P.3
-
11
-
-
0038035318
-
Stress evolution due to electromigration in confined metal lines
-
M. A. Korhonen, P. B0rgesen, K. N. Tu, and C.-Y. Li, "Stress evolution due to electromigration in confined metal lines," 7. Appl. Phys., vol. 73, pp. 3790-3799, 1993.
-
(1993)
Appl. Phys.
, vol.73
, pp. 3790-3799
-
-
Korhonen, M.A.1
Borgesen, P.2
Tu, K.N.3
Li, C.-Y.4
-
12
-
-
0003354983
-
Atomistic and computer modeling of metallization failure of integrated circuits by electromigration
-
R. Kirchheim and U. Kaeber, "Atomistic and computer modeling of metallization failure of integrated circuits by electromigration,'' J. Appl. Phys., vol. 70, pp. 172-181, 1990.
-
(1990)
J. Appl. Phys.
, vol.70
, pp. 172-181
-
-
Kirchheim, R.1
Kaeber, U.2
-
13
-
-
0022207691
-
Electromigration and the current density dependence
-
H. A. Schafft. T. C. Grant, A. N. Saxena, and C. Y. Kao, "Electromigration and the current density dependence," in P roc. 23rd Annu. Reli. Phys. Symp. IEEE. 1985, pp. 93-94.
-
(1985)
P Roc. 23rd Annu. Reli. Phys. Symp. IEEE.
, pp. 93-94
-
-
Schafft, H.A.1
Grant, T.C.2
Saxena, A.N.3
Kao, C.Y.4
-
14
-
-
0015639604
-
Electromigralion and metallization lifetimes
-
R. A. Sigsbee. "Electromigralion and metallization lifetimes," J. Appl. Phys.. vol. 44, pp. 2533-2540, 1973.
-
(1973)
J. Appl. Phys..
, vol.44
, pp. 2533-2540
-
-
Sigsbee, R.A.1
-
15
-
-
0016598188
-
A modified expression for the electromigration time-to-failure
-
A. Bobbio and 0. Saracco. "A modified expression for the electromigration time-to-failure," Microelectronics and Reliability, vol. 14. pp. 431-433, 1975.
-
(1975)
Microelectronics and Reliability
, vol.14
, pp. 431-433
-
-
Bobbio, A.1
Saracco, O.2
-
16
-
-
0024865572
-
Characteristics of electromigration under bidirectional (BC) and pulsed unidirectional (PDC) currents
-
[16[ J. A. Miaz, "Characteristics of electromigration under bidirectional (BC) and pulsed unidirectional (PDC) currents," in Proc 27th Reli. Phys. Symp. lEtt, 1989, pp. 220-228.
-
(1989)
Proc 27th Reli. Phys. Symp. LEtt
, pp. 220-228
-
-
Miaz, J.A.1
-
17
-
-
3643102400
-
Electromigration in conductor stripes under pulsed dc powering
-
A. T. English. K. L. lai, and P. A. Turner "Electromigration in conductor stripes under pulsed dc powering," Appl. Phys. Lett., vol. 21, pp. 397-398, 1972.
-
(1972)
Appl. Phys. Lett.
, vol.21
, pp. 397-398
-
-
English, A.T.1
Lai, K.L.2
Turner, P.A.3
-
19
-
-
0016940795
-
Electromigralion in thin aluminum films on titanium nitride
-
I. A. Blech. "Electromigralion in thin aluminum films on titanium nitride," 7. Appl. Phys., vol. 47, 1203-1206, 1976.
-
(1976)
Appl. Phys.
, vol.47
, pp. 1203-1206
-
-
Blech, I.A.1
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