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We used commercially available sensors [length = 180 μm, width = 18 μm, thickness = 0.6 μm, ν = 0.23, and E = 150 GPa (Park Scientific Instruments, Mountain View, CA)], from which we removed the gold layer. Ti (∼0.5 nm) and Au (∼20 nm) were evaporated just before each experiment. The measured normalized voltage difference ΔV of the PSD indicates the vertical deflection of the sensor. This displacement was calibrated in situ by standard forcedistance curves determining Δz. We estimated the temperature of the micromechanical sensor to be 25°C [R. Berger, Ch. Gerber, J. K. Gimzewski, E. Meyer, H.-J. Güntherodt, Appl. Phys. Lett. 69, 40 (1996)]. Solvents and reagents were used as received from the supplier or as otherwise indicated. Alkanethiols (FLUKA, 95%) were further purified with a short chromatography column to remove high-weight impurities and were then kept under vacuum (∼5 mbar) for 4 hours to remove lower molecular residual thiols. A glass beaker with an opening of 2 cm was filled with 20 μl of the thiol solution, closed with a shutter, and placed 5 cm from the sensor under ambient conditions. Humidity and temperature were kept constant at 50 ± 3% and 22° ± 0.5°C during all experiments. The sensor head was shielded against vibrations, turbulence, and thermal drifts.
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note
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In addition to performing stressometry, we followed the self-assembly of alkanethiols in a similar setup by determining the thicknesses of forming SAMs with ellipsometry. These experiments confirmed the complete replacement of residual contaminants by alkanethiol molecules and also reflected the time scale of forming monolayers as detected by the micromechanical sensor. The measurements confirmed the theoretically expected thicknesses for all SAMs, indicating the high purity of the alkanethiol used. We used this technique to follow the contamination kinetics of physisorbed adsorbates of the clean gold surface. This process emerged on a time scale of ∼2 hours under our typical laboratory conditions.
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We thank D. Anselmetti, H. Biebuyck, P. Guéret, and H. Rohrer for helpful discussions and support, and P. Vettiger and the IBM Zürich micromechanics group for their contributions to optimizing sensor performance. Partially supported by the Swiss National Science Foundation (NFP 36) and Swiss Priority Program MINAST 7.04
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We thank D. Anselmetti, H. Biebuyck, P. Guéret, and H. Rohrer for helpful discussions and support, and P. Vettiger and the IBM Zürich micromechanics group for their contributions to optimizing sensor performance. Partially supported by the Swiss National Science Foundation (NFP 36) and Swiss Priority Program MINAST 7.04.
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