Embedded organic Low-κ Structures for sub-0.18 μm CMOS VLSI MLM: Integration and etching issues

Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999

Volumn , Issue , 1999, Pages 212-214

  Maynard, Helen L ^a   Pai, Chien S ^a   Case, Carlye B ^a   Adebanjo, Richardson O ^b   Baker, Michael R ^a   Tai, W Wai ^a   Liu, Ruichen ^a  

^a LUCENT TECHNOLOGIES   (United States)

^b NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CHEMICAL MECHANICAL POLISHING; CMOS INTEGRATED CIRCUITS; ETCHING; VLSI CIRCUITS;

INTERCONNECT PROCESSING; INTERCONNECT STRUCTURES; LOW-K FILMS; LOW-K MATERIALS; METAL STRUCTURES; OXIDE STRUCTURES; OXIDE-CMP; VIA CHAIN;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84962823863     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.1999.787125     Document Type: Conference Paper

References (4)

1. Laura Peters, Semi. Intl., Sept. 98, p. 64.
2. The Dow Chemical Company, Midland, MI.
3. M. Ikeda et al., IITC Proc. (1998) p. 131.
4. S. P. Jeng et al., VLSI Tech. Symp. Proc. (1994), p. 73