Critical issues in the integration of Copper and low-k dielectrics

Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999

Volumn , Issue , 1999, Pages 262-264

  Donaton, R A ^a   Coenegrachts, B ^a   Maex, K ^a,b   Struyf, H ^a   Vanhaelemeersch, S ^a   Beyer, G ^a   Vervoort, I ^a   Richard, E ^a   Fyen, W ^a   Grillaert, J ^a   Van Der Groen, S ^a   Stucchi, M ^a   De Roest, D ^a  

^a MMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

FIELD EFFECT TRANSISTORS; INTEGRATED CIRCUIT INTERCONNECTS; METALLIZING;

CRITICAL ISSUES; DUAL DAMASCENE; DUAL DAMASCENE STRUCTURES; FRONT END OF THE LINES; GOOD CONTINUITY; INTERLINE CAPACITANCE; METALLIZATION PROCESS; VIA RESISTANCE;

LOW-K DIELECTRIC;

EID: 33847565746     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.1999.787139     Document Type: Conference Paper

References (5)

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