Advanced silicon 1c interconnect technology and design: present trends and rf wireless implications

IEEE Transactions on Microwave Theory and Techniques

Volumn 47, Issue 63 PART 1, 1999, Pages 667-674

  Gutmann, Ronald J ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

Interconnect technology; Virtual Design Environment; Wireless technology projections

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; COMPUTER SOFTWARE; INTEGRATED CIRCUIT LAYOUT; INTERCONNECTION NETWORKS; PRINTED CIRCUIT DESIGN; SEMICONDUCTOR DEVICE MANUFACTURE; WIRELESS TELECOMMUNICATION SYSTEMS;

BACK END OF THE LINE TECHNOLOGY; INTELLECTUAL PROPERTY CORES; SILICON INTEGRATED CIRCUIT INTERCONNECT TECHNOLOGY; SYSTEM ON A CHIP; VIRTUAL DESIGN ENVIRONMENT;

INTEGRATED CIRCUITS;

EID: 0033363025     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.769333     Document Type: Article

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